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Right-the-First-Time Packages
CEO Interview by Semi Wiki
Packaging Insights interview with CEO
Advanced Package Design

For more information please contact:

Chuck Byers

Chief Marketing Officer

charles.byers@sarcina-tech.com

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Established in 2011, Sarcina Technology set the groundwork for a developing segment within the semiconductor industry value chain known as the Application Specific Advanced Packing Service.

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Services

  • Package Design
  • Model Extraction
  • Simulation
  • Channel Simulation
  • Design of Manufacturing
  • SiP and MCM
  • 56 Gb/s PAM-4
  • Wafer Probe Card
  • Final Test Hardware
  • Test Program Development

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  • A: Seestrasse 21
  • T: 00 1 23 45 67 89
  • E: qi@example.com
  • T: 99 8 76 54 321

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