Wafer-To-Chip DesignYou Can Count On ...Every Time
Welcome to Sarcina
Founded in 2011, Sarcina Technology is a semiconductor packaging and testing turnkey company in Palo Alto, California, with a design and supply chain management office in Taipei, Taiwan. It is led by industry veterans from companies like AT&T Bell Labs, DEC, Intel, and TSMC.
The company provides package design, power/signal integrity simulation, wafer probing, final test hardware design, and test program development. Partnering with leading foundries, Sarcina ensures first-time tape-out success across simple to complex packages.
Since expanding assembly and test services in 2018, Sarcina operates on a “wafer-in, chip-out” model—managing everything from test design to supply chain logistics.
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First-time Tape-out Success
Multiple
Turnkey Products
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Package Design Tape-Outs
Sarcina's Services
Lower total packaging costs with Sarcina's exclusive WIPO service. WIPO stands for wafer-in, product-out and it eliminates the exorbitant costs of maintaining a hardware team for packaging, testing, and production. WIPO covers: wafer bumping, wafer sort, package design, test hardware design, design simulations, substrate/hardware fabrication, chips assembly, chips final test, device qualification, and production.
Sarcina provides a complete semiconductor packaging service portfolio.
Technology
Advanced Packaging
2.5D silicon interposer packaging, 3D stacking, MCM/Chiplet Implementation, photonic IC packaging, automotive packaging, and bump pitch transformer from microbump to C4 bump.
Standard Packaging
Seamless design and implementation of flip-chip BGA, wirebond BGA, and QFN packages, enabling quick, convenient, and cost effective solutions.
Simulation
Comprehensive bi-directional channel simulations, including PI/SI, ensure the design meets performance requirements before tape-out for LPDDR5X/DDR5/GDDR6, 112G SerDes, PCIe-6, and 32G UCIe-A/S interfaces, with eye diagram analysis to guarantee smooth data transmission.
See Our Latest Work
Real Examples of Success and Satisfaction from our Applications
