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Sarcina Technology Demonstrates Packaging Capabilities at Chiplet Summit

Showcases WIPO Services   Palo Alto, CA, February 6, 2024 – Sarcina Technology, a leading Application Specific Advanced

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Sarcina Technology Joins Intel Foundry Services (IFS) Accelerator Design Services Alliance

Brings Application Specific Advanced Packaging Services to IFS customers   Palo Alto, CA, January 25, 2024 – Sarcina

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For more information please contact:

Chuck Byers

Chief Marketing Officer

charles.byers@sarcina-tech.com

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Established in 2011, Sarcina Technology set the groundwork for a developing segment within the semiconductor industry value chain known as the Application Specific Advanced Packing Service.

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Services

  • Package Design
  • Model Extraction
  • Simulation
  • Channel Simulation
  • Design of Manufacturing
  • SiP and MCM
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  • Final Test Hardware
  • Test Program Development

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  • E: qi@example.com
  • T: 99 8 76 54 321

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