Sarcina Technology showcases silicon photonic packaging solutions at OFC 2025
Palo Alto, CA – 27 March 2025. Sarcina Technology, a leader in silicon photonic package design and post-silicon services, is pleased to announce its participation in this year’s Optical Fiber Conference (OFC), taking place 30 March-3 April, at the Moscone Center in San Francisco, California. Here the Sarcina team will highlight a wide range of expertise including packaging, testing, qualification, and production for high-performance computing and communication ASIC chips and modules.
The OFC Conference is the premier event for professionals in the optical fiber and silicon photonic industries. Visitors to Booth 3019 will discover more about Sarcina’s cutting-edge solutions in advanced silicon photonic package design. The company will showcase chiplets and silicon photonic ICs capable of achieving data rates up to 224 Gb/s for standalone ASICs, as well as integrated solutions on package substrates designed for high-data-rate optical fiber communications.
“We are excited to participate in OFC 2025 and present our latest innovations,” said Larry Zu, CEO of Sarcina Technology. “This event provides a valuable opportunity to connect with industry leaders and demonstrate how our solutions help address the data transmission bottlenecks between GPUs and memory, particularly in high-performance computing applications such as generative AI. Our unique technology enables advanced data rates of 224 Gb/s for ASIC chips and optical engines, offering a direct solution to these critical challenges.”
Event Details:
• Event name: Optical Fiber Conference (OFC) 2025
• Location: Moscone Center, San Francisco, CA, USA
• Booth number: 3019
• Date: 30 March– 3 April 2025
- Website: www.ofcconference.org
For more information about Sarcina’s ground-breaking solutions and services, please visit www.sarcinatech.com or stop by Booth 3019 during this event.
About Sarcina Technology
Sarcina Technology is a leading provider of silicon photonic semiconductor packaging and testing solutions, headquartered in Palo Alto, California, with a design and supply chain management office in Taipei. Serving top U.S. and European companies, Sarcina specializes in package design, power/signal integrity analysis and thermal simulation. Its comprehensive services include wafer probing, final test hardware design, test program development and device/package qualification. Renowned for its innovation, reliability and proven results, Sarcina delivers high-quality solutions to customers worldwide.
Contact Information:
Sarcina Technology
Email: sales@sarcina-tech.com
Phone: +1 (650) 681-9175
Website: www.sarcinatech.com
