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© Sarcina Technology LLC, All Rights Reserved.

Established in 2011, Sarcina Technology set the groundwork for a developing segment within the semiconductor industry value chain known as the Application Specific Advanced Packing Service.

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Services

  • Package Design
  • Model Extraction
  • Simulation
  • Channel Simulation
  • Design of Manufacturing
  • SiP and MCM
  • 56 Gb/s PAM-4
  • Wafer Probe Card
  • Final Test Hardware
  • Test Program Development

Contact Us

  • A: Seestrasse 21
  • T: 00 1 23 45 67 89
  • E: qi@example.com
  • T: 99 8 76 54 321

© 2024 Sarcina, All Rights Reserved by Design Sketchres

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2.5 D-Si Interposer Package Futuristic
2.5 D-Si Interposer Package Real without background
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