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Established in 2011, Sarcina Technology set the groundwork for a developing segment within the semiconductor industry value chain known as the Application Specific Advanced Packing Service.
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- Package Design
- Model Extraction
- Simulation
- Channel Simulation
- Design of Manufacturing
- SiP and MCM
- 56 Gb/s PAM-4
- Wafer Probe Card
- Final Test Hardware
- Test Program Development
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