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Posts by @MK@Sarcina@MK@mk

Home » Articles Posted by @MK@Sarcina@MK@mk
10 Jul
News Room

Bump Pitch Transformers Will Revolutionize Advanced Packaging

  • December 13, 2024
  • By author-avatar @MK@Sarcina@MK@mk
  • 0 comments
There’s better, cost-effective path to 2.5D packaging landscape San Francisco, CA; June 26, 2024 --- Dr. Larry Zu, Founder an...

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22 Jun
News Room

Sarcina Unveils Bump Pitch Transformer Capabilities New Multi-die Technology Radically Alters 2.5D Packaging Landscape

  • December 13, 2024
  • By author-avatar @MK@Sarcina@MK@mk
  • 0 comments
New Multi-die Technology Radically Alters 2.5D Packaging Landscape Palo Alto, CA; June 18, 2024 --- Sarcina Technology, the A...

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21 Mar
News Room

Sarcina Technology Demonstrates Packaging Capabilities at Chiplet Summit

  • December 13, 2024
  • By author-avatar @MK@Sarcina@MK@mk
  • 0 comments
Showcases WIPO Services  Palo Alto, CA, February 6, 2024 – Sarcina Technology, a leading Application Specific Advanced Pack...

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21 Mar
News Room

Sarcina Technology Joins Intel Foundry Services (IFS) Accelerator Design Services Alliance

  • December 13, 2024
  • By author-avatar @MK@Sarcina@MK@mk
  • 0 comments
Brings Application Specific Advanced Packaging Services to IFS customers   Palo Alto, CA, January 25, 2024 – Sarcina ...

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11 Oct
News Rooms

Google diversity report shows increased attrition for women

  • October 11, 2023
  • By author-avatar @MK@Sarcina@MK@mk
  • 0 comments
Google diversity report shows increased attrition for women

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11 Oct
News Rooms

Google diversity report shows increased attrition for women

  • October 11, 2023
  • By author-avatar @MK@Sarcina@MK@mk
  • 0 comments
Google diversity report shows increased attrition for women

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11 Oct
News Rooms

Google diversity report shows increased attrition for women

  • October 11, 2023
  • By author-avatar @MK@Sarcina@MK@mk
  • 0 comments
Google diversity report shows increased attrition for women

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