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Bump Pitch Transformers Will Revolutionize Advanced Packaging

There’s better, cost-effective path to 2.5D packaging landscape San Francisco, CA; June 26, 2024 — Dr. Larry Zu,

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Sarcina Unveils Bump Pitch Transformer Capabilities New Multi-die Technology Radically Alters 2.5D Packaging Landscape

New Multi-die Technology Radically Alters 2.5D Packaging Landscape Palo Alto, CA; June 18, 2024 — Sarcina Technology, the

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Sarcina Technology Demonstrates Packaging Capabilities at Chiplet Summit

Showcases WIPO Services   Palo Alto, CA, February 6, 2024 – Sarcina Technology, a leading Application Specific Advanced

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Sarcina Technology Joins Intel Foundry Services (IFS) Accelerator Design Services Alliance

Brings Application Specific Advanced Packaging Services to IFS customers   Palo Alto, CA, January 25, 2024 – Sarcina

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For more information please contact:

Chuck Byers

Chief Marketing Officer

charles.byers@sarcina-tech.com

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Established in 2011, Sarcina Technology set the groundwork for a developing segment within the semiconductor industry value chain known as the Application Specific Advanced Packing Service.

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