Technology Available for Licensing

25G Serializer/Deserializer Package Design


  • Sarcina Technology LLC has created a package design method for the optimization of package differential impedance at data rates of 25 Gb/s and beyond which is disclosed in US Patent App 14/729,050.
  • The method optimizes the differential impedance of package vertical interconnections of BGA ball, via, and PTH as well as around the joint between the vertical interconnection and the horizontal interconnection of trace.
  • The invention leads to significant operational improvements and cost savings as explained herein.

Achieved Performance Improvement

      At 8ps rise time:
  • a <5% impedance variation is obtained with a 0.8 mm BGA ball pitch and a 10-layer buildup substrate.
  • a <10% impedance variation is obtained with a 1 mm BGA ball pitch and a 14-layer buildup substrate.
Disclaimer: The information contained in this and/or any other document, materials or form of communication from Sarcina Technology LLC or its agents, now or in the future, related to the intellectual property herein (collectively, the “Information”) is provided in connection with an offer for license of the referenced patent application. The Information does not constitute a legal analysis, opinion, representation or warranty of any kind. The Information is provided solely to aid potential partners in conducting their own independent evaluation to determine whether to participate in licensing discussions with Sarcina Technology LLC. Any statement included in the Information regarding the potential use or applicability of any referenced patent or application to specific products or services is provided solely for illustration purposes and should not be considered a legal analysis. This document and/or any other document, materials or communication is intended for receipt and review only by the parties (and their attorneys or agents) contacted by Sarcina Technology LLC or its agents in connection with the licensing discussions, and any redistribution beyond the receiving party’s organization without Sarcina Technology LLC’s express written permission is strictly prohibited.