Team

Sarcina has assembled a world-class engineering team. Each one of our engineers has 10 to 25 years of industrial experience servicing top US and Taiwan semiconductor companies before joining Sarcina.

They have experience designing hundreds of packages for worldwide customers such as DEC, Intel, Microsoft, Qualcomm, Cisco, Avago, Huawei, Infineon, NTT, and Sony.

Today, millions of Sarcina-designed packages are in the field conducting mission-critical computing and communication tasks, and entertaining billions of people around the globe.