Founded in 2011, Sarcina Technology is a semiconductor packaging company in Palo Alto, California, USA with a design office in Hsinchu, Taiwan. It is led by industrial veterans from places like AT&T Bell Labs, DEC, Intel and TSMC.
Sarcina Technology provides leading US companies with package design and power/signal integrity simulation. In addition, Sarcina offers final test hardware design, program development, and one-stop turnkey service.
We work with the world's foremost foundries to ensure high quality products. We've handled everything, from the simplest to the most complex of packages. Our results are self-evident: since its formation, Sarcina's tapeouts have all been first-time successes.